DOWNLOAD ALL THE MEMS LECTURE NOTES FROM THE LINKS GIVEN BELOW
THESE LECTURE NOTES CONTAIN COMPLETE INFORMATION ABOUT MEMS.
|Introduction: history of MEMS, market for MEMS, overview of MEMS processes, properties of silicon, a sample MEMS process.
Handouts: class syllabus, silicon crystal origami, Petersen’s, Feynman’s.
Lecture Notes: Lecture 1.
|Basics of Microtechnology: definitions and terminology, a sample process, lithography and etching.
References: “There’s Plenty of Room at the Bottom” by Richard Feynman (reprinted in Journal of Microelectromechanical Systems, March 1992); “Silicon as a Mechanical Material” by Kurt Petersen (Proceedings of the IEEE, May 1982).
Handouts: Bio Flow Sensors, MEMS Images. SCREAM
|Introduction to MEMS Pro design software.
Handouts: Following material is MEMScAP ©: MEMSPro tutorial.
Lecture Notes: Following material is MEMScAP ©: MEMS Pro Overview, Layout Prsnt, Layout Tutorial, System Lvl Prsnt., System Lvl Tutorial, ANSYS Add-Ons, ANSYS MEMS, DRC Tutorial.
|Micromachining: subtractive processes (wet and dry etching), additive processes (evaporation, sputtering, epitaxial growth).
Lecture Notes: Lecture 3.
|Fundamental Devices and Processes: basic mechanics and electrostatics for MEMS, parallel plate actuators, pull-in point, comb drives. References: “Laterally Driven Polysilicon Resonant Microstructures” by W. C. Tang, T.-C. H. Nguyen, and R. T. Howe (Proc. IEEE MEMS, February 1989); “Electrostatic-Comb Drive of Lateral Polysilicon Resonators” by W. C. Tang, T.-C. H. Nguyen, M. W. Judy, and R. T. Howe (Transducers, June 1989).
Lecture Notes: Lecture 4.
|Fundamental Devices and Processes: more electrostatic actuators; MEMS foundries, Cronos MUMPs (multi user MEMS process).
Lecture Notes: Lecture 4.
|MUMPs Multi User MEMS Process: review Tang et al. papers; JDS Uniphase MUMPs processing sequence and design rules.
Handouts: MUMPs Design Handbook Chapter 1 (pp. 1-9), Laterally driven paper , Electrostatic comb drive actuator paper.
Lecture Notes: Lecture 5.
|MUMPs and SUMMiT: design rules; applications; micro hinges and deployment actuators.
References: Elliot E. Hui, Roger T. Howe, and M. Steven Rodgers, “Single-Step Assembly of Complex 3-D Microstructures,” Proc. IEEE 13th Int’l Conf. on Micro Electro Mechanical Systems (Miyazaki, Japan, January 23-27, 2000), pp. 602-607.
M. Parameswaran, H.P. Baltes, A.M.Robinson, “Polysilicon Microbridge Fabrication Using Standard CMOS Technology,” IEEE Solid-State Sensor and Actuator Workshop, pp. 148-150, June 1988 (reprinted in Micromechanics and MEMS, IEEE Press 1997).
Lecture Notes: Lecture 6.
|Cleanroom lab techniques: clean rooms, gowning procedures; safety, fire, toxicity; acids and basis; photolithography.
Lecture Notes: Lecture packaging, Lecture 8.
|Thermal Transducers: bimorphs, “heatuators”, cilia arrays.
References: Rebecca Cragun, Larry L. Howell, “Linear Thermomechanical Microactuators,” Proc. ASME IMECE 1999, pp. 181-188.
Lecture Notes: Lecture 9.
|MicroOptoElectroMechanical Systems (MOEMS): micro scanners, digital mirror display, retinal scanning display.
References: “Electrostatic combdrive-actuated micromirrors for laser-beam scanning and positioning” by Meng-Hsiung Kiang; Solgaard, O.; Lau, K.Y.; Muller, R.S., Journal of Microelectromechanical Systems 7(1):27-37, March 1998.*
Lecture Notes: Lecture 10.
|MicroOptoElectroMechanical Systems (MOEMS): grating light valve, corner cube retroreflector, optical switches, other micro-optical devices.
Handouts: Assignment#3 is due. Assignment #4: cover, page 1, page 2, page 3.Lecture Notes: Lecture 11
|Piezoresistivity; Scanning Probe Microscopy: scanning tunneling microscope (STM), atomic force microscope (AFM).
Lecture Notes: Lecture 12.
|Scaling Laws; Midterm Examination review and Q&A.
Lecture Notes: Lecture 13.
|Wireless MEMS: mechanical and electrical resonators, Q-factor, switches, filters.
Lecture Notes: Lecture 14.
|Power for MEMS: thin film batteries, micro fuel cells, energy fields, …
Lecture Notes: Lecture 15.
|MEMS Packaging and Assembly: microassembly: serial and parallel, deterministic and stochastic; microgrippers: HexSil process; packaging techniques.
Lecture Notes: Lecture 16.