DOWNLOAD ALL THE MEMS LECTURE NOTES FROM THE LINKS GIVEN BELOW
THESE LECTURE NOTES CONTAIN COMPLETE INFORMATION ABOUT MEMS.
| Introduction: history of MEMS, market for MEMS, overview of MEMS processes, properties of silicon, a sample MEMS process. Handouts: class syllabus, silicon crystal origami, Petersen’s, Feynman’s. Lecture Notes: Lecture 1. |
| Basics of Microtechnology: definitions and terminology, a sample process, lithography and etching.
References: “There’s Plenty of Room at the Bottom” by Richard Feynman (reprinted in Journal of Microelectromechanical Systems, March 1992); “Silicon as a Mechanical Material” by Kurt Petersen (Proceedings of the IEEE, May 1982). |
| MEMS Biosensors: Handouts: Bio Flow Sensors, MEMS Images. SCREAM |
| Introduction to MEMS Pro design software. Handouts: Following material is MEMScAP ©: MEMSPro tutorial. Lecture Notes: Following material is MEMScAP ©: MEMS Pro Overview, Layout Prsnt, Layout Tutorial, System Lvl Prsnt., System Lvl Tutorial, ANSYS Add-Ons, ANSYS MEMS, DRC Tutorial. |
| Micromachining: subtractive processes (wet and dry etching), additive processes (evaporation, sputtering, epitaxial growth). Lecture Notes: Lecture 3. |
| Fundamental Devices and Processes: basic mechanics and electrostatics for MEMS, parallel plate actuators, pull-in point, comb drives. References: “Laterally Driven Polysilicon Resonant Microstructures” by W. C. Tang, T.-C. H. Nguyen, and R. T. Howe (Proc. IEEE MEMS, February 1989); “Electrostatic-Comb Drive of Lateral Polysilicon Resonators” by W. C. Tang, T.-C. H. Nguyen, M. W. Judy, and R. T. Howe (Transducers, June 1989). Lecture Notes: Lecture 4. |
| Fundamental Devices and Processes: more electrostatic actuators; MEMS foundries, Cronos MUMPs (multi user MEMS process). Handouts: none. Lecture Notes: Lecture 4. |
| MUMPs Multi User MEMS Process: review Tang et al. papers; JDS Uniphase MUMPs processing sequence and design rules. Handouts: MUMPs Design Handbook Chapter 1 (pp. 1-9), Laterally driven paper , Electrostatic comb drive actuator paper. Lecture Notes: Lecture 5. |
| MUMPs and SUMMiT: design rules; applications; micro hinges and deployment actuators. References: Elliot E. Hui, Roger T. Howe, and M. Steven Rodgers, “Single-Step Assembly of Complex 3-D Microstructures,” Proc. IEEE 13th Int’l Conf. on Micro Electro Mechanical Systems (Miyazaki, Japan, January 23-27, 2000), pp. 602-607. M. Parameswaran, H.P. Baltes, A.M.Robinson, “Polysilicon Microbridge Fabrication Using Standard CMOS Technology,” IEEE Solid-State Sensor and Actuator Workshop, pp. 148-150, June 1988 (reprinted in Micromechanics and MEMS, IEEE Press 1997). Lecture Notes: Lecture 6. |
| Cleanroom lab techniques: clean rooms, gowning procedures; safety, fire, toxicity; acids and basis; photolithography. Lecture Notes: Lecture packaging, Lecture 8. |
| Thermal Transducers: bimorphs, “heatuators”, cilia arrays. References: Rebecca Cragun, Larry L. Howell, “Linear Thermomechanical Microactuators,” Proc. ASME IMECE 1999, pp. 181-188. Lecture Notes: Lecture 9. |
| MicroOptoElectroMechanical Systems (MOEMS): micro scanners, digital mirror display, retinal scanning display. References: “Electrostatic combdrive-actuated micromirrors for laser-beam scanning and positioning” by Meng-Hsiung Kiang; Solgaard, O.; Lau, K.Y.; Muller, R.S., Journal of Microelectromechanical Systems 7(1):27-37, March 1998.* Lecture Notes: Lecture 10. |
| MicroOptoElectroMechanical Systems (MOEMS): grating light valve, corner cube retroreflector, optical switches, other micro-optical devices. Handouts: Assignment#3 is due. Assignment #4: cover, page 1, page 2, page 3.Lecture Notes: Lecture 11 |
| Piezoresistivity; Scanning Probe Microscopy: scanning tunneling microscope (STM), atomic force microscope (AFM). Lecture Notes: Lecture 12. |
| Scaling Laws; Midterm Examination review and Q&A. Lecture Notes: Lecture 13. |
| Midterm exam |
| Wireless MEMS: mechanical and electrical resonators, Q-factor, switches, filters. Lecture Notes: Lecture 14. |
| Power for MEMS: thin film batteries, micro fuel cells, energy fields, … Lecture Notes: Lecture 15. |
| MEMS Packaging and Assembly: microassembly: serial and parallel, deterministic and stochastic; microgrippers: HexSil process; packaging techniques. Lecture Notes: Lecture 16. |
